Exhibited at 27th FINETECH JAPAN | April, 10, 2017

Thank you for dropping by our booth at exhibition of "27th FINETECH JAPAN " in Tokyo Big Sight, Japan during 5 to 7 of April, 2017.
If you still need further more information of our products, please let us know it.

  ■TEL : +81-480-72-7500
  ■Mail :
kiki@ohashi-engineering.co.jp
   ※ "Contact us" page on this website is also available.
  
We offer better products to meet your expectation continuously.
We wish you to give us the guidance and support. 

Exhibit at 27th FINETECH JAPAN | March, 7, 2017

We will be exhibiting at 27th FINE TECH JAPAN (LCD/ OLED/ SENSOR TECHNOLOGY EXPO) in Tokyo from 5 April to 7 April.
■Date : 5 (Wed) - 7 (Fri), April, 2017 
   10:00 - 18:00 (-17:00 on 18)
■Site : Tokyo Big Sight, Japan
■Official Website:
http://www.ftj.jp/en/
 You need a free invitation ticket to visit this expo.
 Please request it on the official website, or contact us below.  

 TEL : +81-480-72-7500 
 Email :
kiki@ohashi-engineering.co.jp

■27th FINE TECH JAPAN
■Booth No. :  East Hall 2, 43-31
【Products】
・Fully Automatic ACF Bonder  "CMS-1500" 
・Semi-Automatic ACF Process Line " LS-02  MS-04  BS-03/04"
・Medical panel FOG Bonder   "ME-02"
・Laser Marking System "SLM-01"
We will display posters.

We are looking forward to seeing you.

Exhibited at JPCA Show2016| Jun, 15, 2016

Thank you for dropping by our booth at exhibition of "JPCA Show 2016〜Semiconductor packaging  component built Technology Exhibition〜" in Tokyo Big Sight, Japan during 1 to 3 of Jun, 2016.
If you still need further more information of our products, please let us know it.

  ■TEL : +81-480-72-7500
  ■Mail :
kiki@ohashi-engineering.co.jp
   ※ "Contact us" page on this website is also available.
  
We offer better products to meet your expectation continuously.
We wish you to give us the guidance and support. 

Exhibit at JPCA Show2016| May 11, 2016

OHASHI engineering co.,ltd will show our products at  "JPCA Show 2016 ~Semiconductor packaging  component built Technology Exhibition~" which will be held at the Tokyo Big Sight from June 1st to the 3rd..
■Date : 1 (Wed) - 3 (Fri), May, 2016 
   10:00 - 17:00 
■Site : Tokyo Big Sight, Japan
■Official Website
http://www.jpcashow.com/show2016/index.html
 You need a free invitation ticket to visit this expo.
 Please request it on the official website, or contact us below.  

 TEL : +81-480-72-7500 
 Email :
kiki@ohashi-engineering.co.jp

■"JPCA Show2016 Semiconductor packaging component built-Technology Exhibition"
■Booth No. :  East Hall 5, 5A-03
【Products】
Fully Automatic ACF Bonder  "CMS-1500" 
Si Business  "SMS-01"  
・Semi-Automatic ACF Process Line " LS-02  MS-04  BS-03/04"
Semi-automatic FOG Bonder   "ME-02"

We will display posters and sample Works.

We are looking forward to seeing you.

We gave a presentation in SSL CHINA 2014 | Nov, 13, 2014 

We gave a presentation in the session of “SSL CHINA 2014 China International Forum on Solid State Lighting”.

We had many questions and good impressions from audiences.
Thank you very much for all the participants.

If you could not joined the session this time, it is greatly appreciated that if you could take part in next time.

We give a presentation in SSL CHINA 2014 | Oct, 17, 2014

We give a presentation in the session of “SSL CHINA 2014  China International Forum
on Solid State Lighting”, held in Guangzhou, China.


■SSLCHINA 2014-China International Forum on Solid State Lighting
・Schedule : Nov, 6, 2014  14:45-15:15
・Agenda : “Flip Chip LED COB Bonding Process with Low-Temperature-Curable Conductive Paste”

For more information, please see the official website.
 
http://www.sslchina.org/page/5483/


It is very appreciated if you could participate in the session.
We are looking forward to seeing you.

Fixed trouble of catalog request ID and PW mail. | May, 21, 2014

We fixed trouble of catalog request ID and PW mail.
We apologize to inconvenient you for our network problem
and hope your kindly understanding.

Notice of trouble of catalog request ID and PW mail. | May, 19, 2014

We would like to express you who accessed our catalog request site.
It occurs some trouble that wrong address of URL of catalog download page is mentioned on notification mail of ID and PW.
Please access to following correct URL.

http://www.ohashi-engineering.co.jp/english/catalog/index3.html


We investigate the cause and prepare the countermeasure as soon as possible.
We apologize for your inconvenience and hope your understanding.

Exhibited at 24th FINETECH JAPAN | April, 22, 2014

Thank you for dropping by our booth at exhibition of "24th FINETECH JAPAN " in Tokyo Big Sight, Japan during 16 to 18 of April, 2014.
If you still need further more information of our products, please let us know it.

  ■TEL : +81-480-72-7500
  ■Mail :
kiki@ohashi-engineering.co.jp
   ※ "Contact us" page on this website is also available.
  
We offer better products to meet your expectation continuously.
We wish you to give us the guidance and support. 

Exhibit at 24th FINETECH JAPAN | March, 18, 2014

We OHASHI ENGINEERING exhibits at TOUCH PANEL JAPAN - 6th International Touch Panel Technology Expo (inside 24th FINETECH JAPAN)  to be held from 16 April to 18 April at Tokyo Big Sight, Japan.

■Date : 16 (Wed) - 18 (Fri), April, 2014 
   10:00 - 18:00 (-17:00 on 18)
■Site : Tokyo Big Sight, Japan
■Official Website:
http://www.ftj.jp/en/
 You need a free invitation ticket to visit this expo.
 Please request it on the official website, or contact us below.  

 TEL : +81-480-72-7500 
 Email :
kiki@ohashi-engineering.co.jp

■"TOUCH PANEL JAPAN (inside 24th FINETECH JAPAN)"
■Booth No. :  East Hall 6, 1-25
【Products】
・Optical Resin Laminator "AS-03" 
・Fully Automatic ACF Bonding System "CMS-1200" 
・LED Flip Chip Bonding System "LMS-2000"
・Laser Marking System "SLM-01"
We will display posters and sample Works.

We are looking forward to seeing you.

Thank you for dropping at Lighting Japan 2014 & Internepcon Japan 2014 | January, 20, 2014

Thank you for dropping by our booth at exhibition of "Lighting Japan 2014" and "15th IC Packaging Technology Expo" in Tokyo Big Sight, Japan during 15 to 17 of January, 2014.
If you still need further more information of our products, please let us know it.

  ■TEL : +81-480-72-7500
  ■Mail : kiki@ohashi-engineering.co.jp
   ※Contact form on our website is also available.
  
We offer better products to meet your expectation continuously.
We wish you to give us the guidance and support. 

Exhibit at Lighting Japan 2014 & Internepcon Japan 2014 | 11, December, 2013

We exhibit our machines at "LIGHTING JAPAN 2014 (6th LED/OLED Lighting Technology Expo) " and "INTERNEPCON JAPAN 2014 (15th IC PACKAGING TECHNOLOGY EXPO) " in Tokyo Big Sight.  

■Date: 15 (Wed) - 17 (Fri) , Jan., 2014 
      10:00 - 18:00 (10:00 - 17:00 on 17 (Fri) , Jan.)
■Place: Tokyo Big Sight, Tokyo, Japan
■Official Website:
  "LIGHTING JAPAN 2014" 
http://www.lightingjapan.jp/en/Home/  
  "INTERNEPCON JAPAN 2014"
http://www.icp-expo.jp/en/Home/
 
 You need an invitation ticket to visit these exhibitions.
 Please request it on the official website, or contact us below.
  Tel: +81-480-72-7500 
 Mail:
kiki@ohashi-engineering.co.jp


<LIGHTING JAPAN 2014 (6th LED/OLED Lighting Technology Expo) >
■Booth No.: East Hall 5, 43-17
■Products: LED Flip Chip One-shot Bonder  "LMS-2000"
                    A specialized machine for a lighting module of integrated
                    LED flip chips.
                    We exhibit this machine at our booth.

And we also exhibit a fully automatic ACF bonding system "CMS-1200" at our distributor's booth in "INTERNEPCON JAPAN 2014 (15th IC PACKAGING TECHNOLOGY EXPO)".

<INTERNEPCON JAPAN 2014 (15th IC PACKAGING TECHNOLOGY EXPO) >
■Exhibitor: Ito Corporation
■Booth No.: East Hall 2, 10-16

We are looking forward to seeing you.

Catalog Download Service Available | 28, November, 2013

Now our product catalogs are available on this website.

You need User name and Password to download them, so
please go to Catalog Download Form by
clicking here, or
a button [Catalog Download Request Form] on top page,
and complete the form.
Catalog Image

Exhibited at FPD International 2013 | 29, October, 2013 

Thank you so much for joining us at FPD international 2013
in PACIFICO YOKOHAMA 23-25, October, 2013.
We are pleased that we had so many atendees.

If you have any questions or need further information,
please do not hesitate in contact us.   

  ■TEL :  +81-480-72-7500  (Sales section)
  ■E-mail : 
kiki@ohashi-engineering.co.jp
  ※Contact form on our website is also available.
OHASHI booth at FPD International 2013

Exhibit at FPD International 2013 | 15, October, 2013

We exhibit our new products at FPD International 2013 (23-25, October, 2013) in
PACIFICO YOKOHAMA.

■Date:23(Wed.)-25(Fri.), October, 2013 10:00〜17:00 
■Place:PACIFICO YOKOHAMA (Kanagawa, Japan)
■Official Website: 
http://expo.nikkeibp.co.jp/fpd/2013/english/  
If you do not have any ticket, you will be charged JPY 2,000 to enter.
Please register at the official website or contact us about invitation ticket.
         TEL:   +81-480-72-7500  
         E-Mail:
kiki@ohashi-engineering.co.jp 
■Booth No.:4722 (C Hall) 
■Product
 CMS-1200 Fully Automatic ACF Bonding System (for Touch Panel)
 We demonstrate it at our booth.
 We would be very happy if we could see you.

Site Renewal |10, October, 2013

We have completed a renewal of the company Website.

LIGHTING JAPAN-4th LED/OLED Lighting Technology Expo|December 12, 2011 

 We participate to 「LIGHTING JAPAN-4th LED/OLED Lighting Technology Expo 」
at Tokyo Big Sight from 18th till 20th , January 2012.

■Exhibit period : Jan. 18 (Wed) 〜20(Fri) , 2012 10:00-18:00 (10:00-17:00 on Jan. 20)
■Location : Tokyo Big Sight , Japan
■Official site:
http://www.lightingjapan.jp/en/Home/
  Please contact to our sales section if entry ticket is needed.
  TEL: 0480-72-7500
  Email:
kiki@ohashi-engineering.co.jp
■Booth number : WEST L1-3 (Manufacturing Equipment Zone)
■Exhibit Products
   LED Flip Chip “One Shot” Bonding System 「LMS-2000」
   We have a demonstration of new product “LMS-2000” for Integrated LED Lighting.
   We are looking forward to your coming.

Participate 「FPD International 2011 Exhibit」|September 26, 2011  

 We had our booth at 「FPD International 2011 」which is held at Yokohama Pacifico
Tokyo in Japan for three days from October 26 till 28, 2011.

■Exhibit period : October 26(WED) 〜28(FRI) , 2011  10:00-17:00
■Location : Pacifico Yokohama , Japan
■Official site:
http://expo.nikkeibp.co.jp/fpd/2011/
  Entry fee is 2,000 Japanese Yen. Free of charge for who have an invitation ticket
   or who register through the website as above in advance.
   Please feel free to contact us!
   TEL: 0480-72-7500
   E-Mail:
kiki@ohashi-engineering.co.jp
■Booth number : 6402
■Exhibit Products
   ・Optical Regin laminator equipment:AS-04(New product)/AS-03/AS-RD
   ・ACF Semi-Automatic equipment for FOB(LS-02,BS-03).
   ・ACF Alignment equipment for FOB(MS-04)
   ・ACF Full Automatic equipment for FOB(FAS-7135) 

Joined to「4th Processing engineering exhibit conference in Ota-ku, Tokyo Japan」|May 26, 2011 

 Precision sheet metal division had our booth in「4th Processing engineering exhibit conference in Ota-ku, Tokyo Japan」

■Exhibition period : July 1st (FRI), 2011  10:00 -17:00
■Exhibition place : Ota-ku Industrial Plaza Pio 1F Conference hall
■Official web site :
http://ota-tech2011.jp/index.html Thank you very much for your visit to our booth!.

pagetop

Archives

COPYRIGHT (C) OHASHI ENGINEERING. ALL RIGHTS RESERVED.