ACP Process

ACP Process

To dispense ACP on printed pattern on substrate and place LED Flip Chip on ACP, then heat bonding of multiple chips by one shot. It is effective to reduce Cost of LED COB due to No Au wire and No Au bump, and enlarge lighting power with small package.

  

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LMS-2000@LED Flip Chip Bonding System

LMS-2000

LMS-2000
LED Flip Chip Bonding System


ŸOutline
LMS-2000 is the fully automatic LED flip chip bonder which has ACP dispenser, high density mounting and one-shot final bonding with 100~190mm head.

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LM-02@LED Flip Chip Mounter

LM-02

LM-02
LED Flip Chip Mounter

ŸOutline
LM-02 is a semi-automatic typed LED Flip Chip Mounter which is suitable for R&D purpose, trial production and small-sized workshop. It is preferable to Flip Chip mount or Direct Die mount.


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LB-02@LED Flip Chip Bonder

LB-02

LB-02
LED Flip Chip Bonder

ŸOutline
LB-02 is a semi-automatic LED Flip Chip Bonder and can handle a few chips to 100 chips by large heated head which can manage wide range of customer needs.

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